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Results 1 to 25 of 287

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Development of etch hillocks on different Si(hkl) planes in silicon anisotropic etchingZUBEL, I; KRAMKOWSKA, M.Surface science. 2008, Vol 602, Num 9, pp 1712-1721, issn 0039-6028, 10 p.Article

Effects of mask misalignment and wafer misorientation on silicon V-groove etchingTAN, Songsheng; BOUDREAU, Robert; REED, Michael L et al.Sensors and materials. 2003, Vol 15, Num 2, pp 101-112, issn 0914-4935, 12 p.Article

Anisotropic etching of silicon as a tool for creating injection molding tooling surfacesWERKMEISTER, Jaime; GOSALVEZ, Miguel A; WILLOUGHBY, Patrick et al.Journal of microelectromechanical systems. 2006, Vol 15, Num 6, pp 1671-1680, issn 1057-7157, 10 p.Article

Analytical Solution of the Continuous Cellular Automaton for Anisotropic EtchingGOSALVEZ, Miguel A; YAN XING; SATO, Kazuo et al.Journal of microelectromechanical systems. 2008, Vol 17, Num 2, pp 410-431, issn 1057-7157, 22 p.Article

Anisotropic Si etching condition for preparing optically smooth surfacesSASAKI, Minoru; FUJII, Takehiro; HANE, Kazuhiro et al.Sensors and materials. 2003, Vol 15, Num 2, pp 83-92, issn 0914-4935, 10 p.Article

Differences in etching characteristics of TMAH and KOH on preparing inverted pyramids for silicon solar cellsYUJIE FAN; PEIDE HAN; PENG LIANG et al.Applied surface science. 2013, Vol 264, pp 761-766, issn 0169-4332, 6 p.Article

Silicon template fabrication for imprint process with good demolding characteristicsKAWATA, Hiroaki; MATSUE, Masato; KUBO, Kensuke et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 700-704, issn 0167-9317, 5 p.Conference Paper

Surface modification of highly oriented pyrolytic graphite by reaction with atomic nitrogen at high temperaturesLUNING ZHANG; PEJAKOVIC, Dusan A; GENG, Baisong et al.Applied surface science. 2011, Vol 257, Num 13, pp 5647-5656, issn 0169-4332, 10 p.Article

Fabrication of high-compact nanowires using alternating photoresist ashing and spacer technologyHAIYANG MAO; WENGANG WU; YULONG ZHANG et al.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 8, issn 0960-1317, 085029.1-085029.6Article

Precise [100] crystal orientation determination on <110>-oriented silicon wafersTSENG, Fan-Gang; CHANG, Kai-Chen.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 1, pp 47-52, issn 0960-1317, 6 p.Article

Difference in activated atomic steps on (111) silicon surface during KOH and TMAH etchingSATO, Kazuo; MASUDA, Takehiro; SHIKIDA, Mitsuhiro et al.Sensors and materials. 2003, Vol 15, Num 2, pp 93-99, issn 0914-4935, 7 p.Article

Fabrication of sub-20 nm nanostructures by combination of nano plastic forming and etching (NPFE)RASHIDI, Hassan; YOSHINO, Masahiko.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 9, issn 0960-1317, 095003.1-095003.10Article

Fracture fabrication of precision single-crystal silicon surfaces for MEMS devicesSPRUNT, Alexander; SLOCUM, Alexander; LANG, Jeffrey H et al.Precision engineering. 2011, Vol 35, Num 3, pp 406-415, issn 0141-6359, 10 p.Article

Silicon microoptical mirrors to make close parallel beams with conventional laser diodesMORI, Tetsuji; SUGAWARA, Satoru; ADACHI, Kazuhiko et al.Journal of microelectromechanical systems. 2005, Vol 14, Num 1, pp 37-43, issn 1057-7157, 7 p.Article

Macroporous silicon-based deep anisotropic etchingTAO, Yi; ESASHI, Masayoshi.Journal of micromechanics and microengineering (Print). 2005, Vol 15, Num 4, pp 764-770, issn 0960-1317, 7 p.Article

Anisotropic etching of silicon in a two-component alkaline solutionVAZSONYI, E; VERTESY, Z; TOTH, A et al.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 2, pp 165-169, issn 0960-1317, 5 p.Article

Fast prototyping of high-aspect ratio, high-resolution X-ray masks by gas-assisted focused ion beamKHAN MALEK, C; HARTLEY, F. T; NEOGI, J et al.Microsystem technologies. 2003, Vol 9, Num 6-7, pp 409-412, issn 0946-7076, 4 p.Article

Applications and simulation of unconventional bulk-micromachining using underetching of {100} silicon planesSCHRÖPFER, G; DE LABACHELERIE, M; TELLIER, C. R et al.Microsystem technologies. 1999, Vol 5, Num 4, pp 194-199, issn 0946-7076Article

Reflectivity of an etched silicon surface with pyramids: II. Experimental results from different etching conditionsCHEN JIAN WU; WEI, Pal-Jen; JEN FIN LIN et al.Journal of micromechanics and microengineering (Print). 2009, Vol 19, Num 12, issn 0960-1317, 125019.1-125019.6Article

A cellular automaton-based simulator for silicon anisotropic etching processes considering high index planesZHOU, Zai-Fa; HUANG, Qing-An; LI, Wei-Hua et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 4, issn 0960-1317, S38-S49Article

Formation and field emission property of single-crystalline Zn microtip arrays by anodizationKUAN, C. Y; CHOU, J. M; LEU, I. C et al.Electrochemistry communications. 2007, Vol 9, Num 8, pp 2093-2097, issn 1388-2481, 5 p.Article

Faster simulations of step bunching during anisotropic etching : formation of zigzag structures on Si(1 10)GOSALVEZ, M. A; XING, Y; HYNNINEN, T et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 4, issn 0960-1317, S27-S37Conference Paper

A novel process for perfect convex corner realization in bulk micromachiningPAL, Prem; CHANDRA, Sudhir.Journal of micromechanics and microengineering (Print). 2004, Vol 14, Num 10, pp 1416-1420, issn 0960-1317, 5 p.Article

Effect of magnesium in KOH solution on anisotropic wet etching of siliconTANAKA, Hiroshi; DI CHENG; INOUE, Kazuyuki et al.International symposium on micro-nano mechatronics and human science. 2004, pp 121-125, isbn 0-7803-8607-8, 1Vol, 5 p.Conference Paper

A phase-change type micropump with aluminum flap valvesWOO YOUNG SIM; HYEUN JOONG YOON; OK CHAN JEONG et al.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 2, pp 286-294, issn 0960-1317, 9 p.Article

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